• Contact Email: iceim_conf@vip.163.com

ICEIM 2023 has been successfully held hybrid in Osaka Institute of Technology, Japan during September 1-3, 2023 which is hosted by Osaka Institute of Technology and sponsored by Tokyo Denki University.

It's exciting to resume offline mode and meet each other face to face. This year, we have an exciting schedule. On the first day, the local chair Prof. Toshio Haga took participants over Student Factory and Observation Floor and introduced their various advanced equipment.

In the following two days, 3 keynote speeches and 6 parallel sessions are conducted. Based on the conference theme, attendeees shared research results and disscused on topics such as Metallurgy, Metalworking, and Applied Mechanics, Properties and Applications of Nanomaterials and Polymers, Advanced Engineering Materials and Solid Mechanics, Nanomedicine and Biomedical Materials, Mechanical Engineering and 3D Printing and Material Physics and Mechanical Manufacturing, etc.

Keynote Speakers

Prof. Osamu TABATA (IEEE Fellow, IEEJ Fellow)
Kyoto University of Advanced Science, Japan
Speech Title: Sacrificial DNA Origami Technique for Nanosensing

Prof. Hisaki Watari (Professor (Full) in the School of Science and Engineering)
Tokyo Denki University, Japan
Speech Title: Effect of Heat Treatment of Magnesium Alloys and Silane Coupling Condition on Bonding Strength of Laminated Mg Alloy/Polymer Material

Prof. Zengtao Chen (Fellow of American Society of Mechanical Engineers (ASME) and Canadian Society for Mechanical Engineering (CSME))
University of Alberta, Canada
Speech Title: Thermomechanical Stability of Delaminated Graphene Nanocomposite Plates

Excellent Oral Presentation

Title: Endogenous miRNA-Activated Dynamic Assembly of DNA materials in Living Cells for Intracellular miRNA Imaging
Authors: Wenyu Sun, Hui Jiang
Presenter: Wenyu Sun, Southeast University, China


Title: Development of Recurrent Neural Network Model for Bridge Effect Detection by Various Fibers Incorporated in Fiber-Reinforced Concrete
Authors: Dongwook Kim; Sung-gul Hong
Presenter: Dongwook Kim, Seoul National University, Republic of Korea