ICEIM 2019


2019 8th International Conference on Engineering and Innovative Materials

 

2019 8th International Conference on Engineering and Innovative Materials

Welcome you to submit your paper now.

ICEIM 2019

2019 8th International Conference on Engineering and Innovative Materials

8th International Conference on Engineering and Innovative Materials

Tokyo Denki University | September 6-8, 2019

 

2019 8th International Conference on Engineering and Innovative Materials (ICEIM 2019) will be held in Tokyo Denki University, Tokyo, Japan during September 6-8, 2019.


The conference will include plenary lectures from distinguished scientists and technologists, keynote speeches, oral presentations and poster sessions. In addition, visits to the industrial places is arranged in the post conference activities. This Conference focuses around the theme: Materials Science and Engineering, Materials Properties, Measuring Methods and Applications, Methodology of Research and Analysis and Modeling, Materials Manufacturing and Processing and 3D printing material, nanomaterial, etc. More conference topics, please click.

 

Submitted papers will be reviewed by 2-3 peer reviewers. And accepted papers will be published in a volume of Key Engineering Materials (ISSN print 1013-9826; ISSN cd 1662-9809; ISSN web 1662-9795), which could be indexed by Ei Compendex, SCOPUS, SCImago Journal & Country Rank (SJR), Inspec, Chemical Abstracts Service (CAS), etc. More details, please see: https://www.scientific.net/KEM/Details

Welcome you to submit your paper by Electronic Submission System. (http://www.easychair.org/conferences/?conf=iceim2019)

 

After conference, some selected and extended papers (with at least new 50% content) will be recommended to Coatings (ISSN 2079-6412; CODEN: COATED) for review and after passing review, will be published in the special issue. (Read more)

Impact Factor: 2.350

Indexing: Scopus (Elsevier), Science Citation Index Expanded - Web of Science (Clarivate Analytics), Web of Science (Clarivate Analytics), etc. (Read more)

 

Listener Registration

   

August 2, 2019 Good News! Welcome Prof. Ya-Fen Wu, Ming Chi University of Technology, Taiwan, Prof. Ho-Sung Lee, Korea Aerospace Research Institute, South Korea, and other 4 experts to join in our technical committees. (Click)

July 6, 2019 Good News! Considering some authors' requests, the submission deadline has been extended to July 15, 2019(Final Call). Welcome you to submit the paper!(Click)

May 17, 2019 Good News! Welcome Prof. Carlos Suzuki, University of Campinas, Brazil, Prof. Chil-Chyuan Kuo, Ming Chi University of Technology, Taiwan, and Assoc. Prof. Sutasinee Neramittagapong, Khon Kaen University, Thailand to join in our technical committees.(Click)

April 24, 2019 Good News! Welcome Prof. Ken-ichi Manabe, Tokyo Metropolitan University, Japan to make the keynote speech . (Click)

Feb. 22, 2019 Good News! The publication has been confirmed. Accepted papers will be published in a volume of Key Engineering Materials (ISSN: 1662-9795).

December 25, 2018 Good News! Accepted papers in ICEIM 2018 has been published in Key Engineering Materials and been online.(Read more)

September 11, 2018 Good News! ICEIM 2019 will be held in Tokyo Denki University, Tokyo, Japan during September 6-8, 2019.

May 11, 2018 Good News! Accepted papers in ICEIM 2017 has been indexed by Scopus. (Read More)

May 7, 2018 Good News! Accepted papers in ICEIM 2017 has been indexed by Ei Compendex(Read More)

Jan. 16, 2018 Good News! Accepted papers in ICEIM 2017 has been online in TTP Press!

 

 

ICEIM 2018

ISBN: 978-3-0357-1368-8

to be indexed by Ei Compendex and Scopus soon...

ICEIM 2017

ISBN:978-3-0357-1209-4
*EI Compendex 
*Scopus Index

 

 

ICEIM 2016

ISBN:978-3-03835-770-4
*EI Compendex 
*Scopus Index

 

 

ICEIM 2015

ISSN: 2261-236X
*EI Compendex 
*Scopus Index

 


 

ICEIM 2014

ISBN: 978-3-03835-285-3 
*EI Compendex 
*Scopus Index

 

 

 

 

 

 

Held in             Supported by                                                                                                    Published by

 

         

 

Technically Supported by