Call for Paper(CFP)

2017 6th International Conference on Engineering and Innovative Materials  (ICEIM 2017) will be held in Setagaya Campus, Kokushikan University,Tokyo, Japan during September 3-5, 2017. This conference provides opportunities for the different areas delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. We hope that the conference results constituted significant contribution to the knowledge in these up to date scientific field. The organizing committee of conference is pleased to invite prospective authors to submit their original manuscripts to ICEIM 2017.

The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. Topics of interest for submission include, but are not limited to:

Materials Science and Engineering

Metallic Alloys, Tool Materials, Superplastic Materials, Ceramics and Glasses, Composites, Amorphous Materials, Nanomaterials, Biomaterials, Multifunctional Materials, Smart Materials, Engineering Polymers, Functional materials, Nuclear fuel materials, Biomaterals, sensors and surfaces, Thin Film Chalcogenide Photovoltaic Materials, Nuclear Materials IV, Magnetic Materials, Multi Functional Magnetic Materials, Superconducting Materials, Structured Materials, Spintronics Materials and Devices, Hard/Soft Magnetic Materials, Crosscutting materials 

Materials Properties, Measuring Methods and Applications 

Ductility, Crack Resistance, Fatigue, Creep-resistance, Fracture Mechanics, Mechanical Properties, Electrical Properties, and Magnetic Properties, Corrosion, Erosion, Wear Resistance, Non-Destructive Testing, Reliability Assessment, Toxicity, Working Properties of Materials and Products, Large Scale Applications, Electronics Applications 

Methodology of Research and Analysis and Modeling

Electron Microscopy, X-ray Phase Analysis, Metallography, Quantitative Metallography, Image Analysis, Computer Assistance in the Engineering Tasks and Scientific Research, Numerical Techniques, Statistic Methods, Residual Life Analysis, Process Systems Design, Mould Flow Analysis, Rapid Prototyping, CAM, CAMS, CAQ, Engineering Design, Technological Design, Materials Design, Computational Material Science, Materials and Engineering Databases, Expert Systems, Artificial Intelligence Methods 

Materials Manufacturing and Processing

Casting, Powder Metallurgy, Welding, Sintering, Heat Treatment, Thermo-Chemical Treatment, Thin & Thick Coatings, Surface Treatment, Machining, Plastic Forming, Quality Assessment, Automation Engineering Processes, Robotics, Mechatronics, Technological Devices and Equipment, Theoretical Fundamentals of Cleaner Production, Industrial Application of Cleaner Production Methods, Production and Operations Management, Production Planning and Control, Manufacturing Technology Management, Quality Management, Environmental Management, Safety and Health Management, Project Management, Physical Distribution and Logistics Management, Supply Chain Management, Productivity and Performance Management

Policy on plagiarism

All submitted articles should report original, previously unpublished research results, experimental or theoretical. Articles submitted to the conference should meet these criteria and must not be under consideration for publication elsewhere. We firmly believe that ethical conduct is the most essential virtual of any academic. Hence any act of plagiarism is a totally unacceptable academic misconduct and cannot be tolerated. If an author is found to commit an act of plagiarism, the following acts of sanction will be taken:

Reject the article submitted or delete the article from the final publications.
Report the authors' violation to his/her supervisor(s) and affiliated institution(s)
Report the authors' violation to the appropriate overseeing office of academic ethics and research funding agency.
Reserve the right to publish the authors' name(s), the title of the article, the name(s) of the affiliated institution and the details of misconduct, etc. of the plagiarist.

Conference Venue

  • Address: Setagaya Campus, Kokushikan University,Tokyo,Japan
  • Email: iceim_conf@vip.163.com
  • Tel: +86-18381008370

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